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A Guide to Building Chiplets Today While Shaping Tomorrow’s Standards

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How Simulation Is Advancing Quantum Computing R&D

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Next Steps for the Cadence and SkyWater MPW Service

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Automotive chiplets: The path towards modularity, improved cost structures and supply resilience

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Root of Trust: A Security Essential for Cyber Defense

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AI in VLSI Physical Design: Opportunities and Challenges

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AI-Driven and Traditional Approaches to Accident Scenario Reconstruction

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Design Approaches and Architectures of RISC-V SoCs

Maven Silicon

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Unlocking the Power of Digital Twins in ASICs with Adaptable eFPGA Hardware

Menta

Bridging Design Verification Gaps with Formal Verification

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Post-Quantum Cryptography: Why Open Source alone is Not Enough for Secure IP Deployment

Dr. Reza Azarderakhsh

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The Blind Spot of Semiconductor IP Sales

Petri Heliö, Principal IC Designer

CoreHW

SWE-Bench-C Evaluation Framework

Vayavya Labs

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Today on Design And Reuse

## **PUFsecurity’s PUFrt Anchors the Security of Silicon Labs’ SoC to Achieve the Industry’s First PSA Certified Level 4** *- October 31, 2025*

## **Synopsys Spotlights Agentic AI, Accelerated Computing, and AI Physics at NVIDIA GTC Washington, D.C.** *- October 30, 2025*

## **Faraday Reports Third Quarter 2025 Results** *- October 30, 2025*

## **Cadence Reports Third Quarter 2025 Financial Results** *- October 30, 2025*

## **Socionext Unveils "Flexlets™", a Configurable Chiplet Ecosystem to Accelerate Multi-die Silicon Innovation** *- October 30, 2025*

## **GlobalFoundries Plans Billion-Euro Investment to Expand Chip Manufacturing in Germany** *- October 30, 2025*

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Security

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## **PUFsecurity’s PUFrt Anchors the Security of Silicon Labs’ SoC to Achieve the Industry’s First PSA Certified Level 4** *- October 31, 2025*

## **FortifyIQ Secures the Quantum Era with Over-the-Air Updatable Cryptography** *- October 27, 2025*

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Artificial Intelligence

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## **Synopsys Spotlights Agentic AI, Accelerated Computing, and AI Physics at NVIDIA GTC Washington, D.C.** *- October 30, 2025*

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Business

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## **Faraday Reports Third Quarter 2025 Results** *- October 30, 2025*

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Chiplet / Multi-Die

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## **Socionext Unveils "Flexlets™", a Configurable Chiplet Ecosystem to Accelerate Multi-die Silicon Innovation** *- October 30, 2025*

## **Tenstorrent Announces Open Chiplet Atlas™ Ecosystem to Accelerate and Standardize an Open Chiplet Ecosystem** *- October 23, 2025*

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Foundry

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## **GlobalFoundries Plans Billion-Euro Investment to Expand Chip Manufacturing in Germany** *- October 30, 2025*

## **Advanced Deposition Chemistry for Sub-2nm Chips** *- October 27, 2025*

## **Cambridge GaN Devices partners with GlobalFoundries for advanced power devices** *- October 27, 2025*

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Design IP

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## **Ceva and embedUR systems Partner to Launch ModelNova for NeuPro NPU Family, Expanding Edge AI Model Ecosystem** *- October 29, 2025*

## **SmartDV Announces Multiple Customer Licenses for MIPI® SoundWire® I3S℠ 1.0 IP Portfolio** *- October 27, 2025*

## **Preliminary Characterisation Report for Perceptia’s pPLL08W in GF 22FDX Now Available** *- October 23, 2025*

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Internet of Things

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## **Nordic Semiconductor first to bring Bluetooth Channel Sounding to open-source Android app** *- October 28, 2025*

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RISC-V

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## **CAST looks to simplify RISC-V IP adoption with new program** *- October 27, 2025*

## **RISC-V Takes First Step Toward International Standardization as ISO/IEC JTC1 Grants PAS Submitter Status** *- October 27, 2025*

## **RISC-V Exceeding Expectations in AI, China Deployment** *- October 23, 2025*

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Automotive

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## **Tesla splits AI5 chip production between Samsung and TSMC in strategic dual-foundry move** *- October 27, 2025*

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Design Platform

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## **SiPearl Unveils Athena1 Processor for Europe’s Dual-Use Needs** *- October 23, 2025*

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Green Electronics

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## **The Green Revolution in Silicon: How the Semiconductor Industry is Forging a Sustainable Future** *- October 20, 2025*

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